Our newest competition, Hack3D serves to raise awareness in both scientific and manufacturing communities about the need for anti-counterfeiting methods in 3D printing.
In the Qualifying Round, competitors are tested in reverse engineering a 3D CAD model based on the G-code file which contains toolpath and coordinates information.
In the Final Round, teams will compete in 3D printing high-quality parts using CAD files that have been embedded with anti-counterfeiting features.
Students who are interested in CAD solid modeling, reverse-engineering, and rapid prototyping are highly encouraged to register.
- CSAW US-Canada - hosted by NYU Tandon School of Engineering
June 5, 2019: Registration Opens. Qualification Round instructions are distributed to registered teams on a rolling basis (approximately once a week)
September 15, 2019: Registration closes
September 22, 2019: Qualification Round submissions are due
No later than October 7, 2019: Finalist notification
November 7 - 8, 2019: in-person Final competition
Add your name and we will email you when registration is live.