Our newest competition, Hack3D serves to raise awareness in both scientific and manufacturing communities about the need for anti-counterfeiting methods in 3D printing.

In the Qualifying Round, competitors are tested in reverse engineering a 3D CAD model.

In the Final Round, teams will compete in printing 3D parts that have been embedded with anti-counterfeiting features.

Participation Regions

  • CSAW US-Canada - hosted by NYU Tandon School of Engineering


May 7, 2018: Registration opens

July 2, 2018: Qualification Round instructions are distributed to registered teams on a rolling basis (approximately once a week)

August 14, 2018: Registration closes

September 14, 2018 October 5, 2018: Qualification Round submissions are due

no later than October 5, 2018 October 10, 2018: Finalist notification

November 8 - 10, 2018: in-person Final competition  


Registration has closed. 


Student Leads + Faculty Advisors

Competition eligibility + registration link

Final round experts for Hack3D

Awards given for 1st, 2nd, and 3rd place

See the finalists of the Hack3D competition.

The Hack3D winners of CSAW'18.