Our newest competition, Hack3D serves to raise awareness in both scientific and manufacturing communities about the need for anti-counterfeiting methods in 3D printing.
In the Qualifying Round, competitors are tested in reverse engineering a 3D CAD model.
In the Final Round, teams will compete in printing 3D parts that have been embedded with anti-counterfeiting features.
- CSAW US-Canada - hosted by NYU Tandon School of Engineering
May 7, 2018: Registration opens July 2, 2018: Qualification Round instructions are distributed to registered teams on a rolling basis (approximately once a week) August 14, 2018: Registration closes September 14, 2018 October 5, 2018 no later than October 5, 2018 October 10, 2018: Finalist notification
November 8 - 10, 2018: in-person Final competition
Registration has closed.